We are looking for an experienced full-time PCB designer who can help us do PCB design planning and feasibility study, PCB/package co-design, component placement and routing, PCB design and methodology development.
Responsibilities:
- PCB technology and material selection
- Stackup definition, power planning, high-speed signal route study with SIPI engineers
- Footprint and library build up
- Critical component ballmap optimization with package designers
- Feasibility study
- Component placement
- Power constraints
- HSIO constraint manager file generation
- Impedance calculation
- DFM/DFA
- PCB design methodology development
- PCB vendor interaction
Requirements:
- Knowledge and experience of high power, high speed, high layer count PCB design
- Advanced PCB material and technology knowledge
- Expert with Cadence Allegro PCB and APD tool chain
- Willing to and proactively engage with system EE, SIPI, thermal/mechanical engineer, and package designers on early design exploration and solution path finding
- Basic SIPI knowledge
- Basic thermal/mechanical knowledge
- CPU/SOC/Microcontroller overall knowledge
- Excellent communication skills
- Great team player
- Highly motivated and self driven
Education and Experience:
- Bachelor’s degree or technical training in PCB design
- CPU server, networking board design experience preferred
- Minimum 7 years related experience
